High-performance heat dissipation material for electronic devices
Adopted by the supercomputer "Fugaku"! Introducing a high-performance thermal paste that is "silicone-free" and does not generate low molecular weight siloxanes!
"Cosmo Thermal Grease" and "Cosmo Thermal Gap Filler" are high-performance thermal pastes. Since they do not use silicone-based materials, there is no concern about contact failure due to low molecular siloxanes. Please choose between grease (non-curing type) and gap filler (curing type) according to your application. "Cosmo Thermal Grease" is a non-curing type thermal paste that can be spread thinly up to several tens of micrometers. It is used in many fields, including computer CPUs, wireless base stations, office multifunction devices, car navigation systems, and home appliances. "Cosmo Thermal Gap Filler" is a curing type thermal paste. The amount applied can be controlled to any desired thickness, resulting in less stress on the components. You can choose between a one-component heat-curing type and a two-component room-temperature curing type. *For more details, please refer to the PDF document or feel free to contact us.
- 企業：コスモ石油ルブリカンツ
- 価格：Other
